NXP Semiconductors NV recently announced the launch of a new generation of low VF Schottky rectifiers for the mobile device market, marking a new and important benchmark for miniaturization. The new DFN1608D-2 (SOD1608) plastic package is typically 0.37 mm thick and 1.6 x 0.8 mm. It is the smallest device on the market that supports up to 1.5A. The DFN1608D-2 includes six models of Schottky barrier rectifiers: three for the 20V model with very low forward voltage and three for the 40V model with very low reverse current. The average forward current range is from 0.5 to 1.5A.
NXP's new Schottky rectifiers offer significant space savings and industry-leading power characteristics due to the large heat sink on the bottom of the package. The extremely low forward voltage of these Schottky diodes reduces power consumption and extends the battery life of mobile devices. Typical applications include battery charging for small portable devices, display backlighting, switch mode power supply (SMPS), and DC/DC conversion. The 1.5A model can be applied to larger devices such as tablets.
The DFN1608D-2 series of rectifiers is also very attractive to equipment manufacturers, thanks to the unique side pads, which prevent oxidation and ensure the solderability of the sides. Unlike other leadless solutions where the solder contacts are hidden under the package, this side pad helps prevent the package from tilting on the PCB, further improving the flatness of the PCB and maximizing stack density. In addition, soldering the package from the side also facilitates visual inspection of the contacts. The DFN1608D-2 also increases the cost efficiency of the production process by eliminating the need to inspect solder contacts with expensive, complex X-ray equipment.
Dr. Wolfgang Bindke, Marketing Manager, NXP Diode Products, said: "For mobile device designers, these devices have also achieved real breakthroughs in miniaturization and current density, adding unprecedented options to this size. For smartphones For the needs of ultra-thin applications, we have produced the flattest 1A (and above) leadless plastic package on the market, and only four times the size of the device on the market today has the same level of performance parameters. Another best example of HP's customer-focused innovation design."
characteristic
· Average forward current: IF (AV) up to 1.5A
· Reverse voltage: VR up to 40V
· Low forward voltage VF, down to 410mV
· Low reverse current
· Passed AEC-Q101 certification
· Ultra-small size (1.6 x 0.8 mm only), leadless SMD plastic package DFN1608D-2
· Solderable tin side pad
· Package height (typical): 0.37mm
Time to market
Now available and in volume production:
· PMEG2005EPK, 20V, 0.5A
· PMEG2010EPK, 20V, 1A
Samples of imported designs are available and production is scheduled to begin in March 2012:
· PMEG2015EPK, 20V, 1.5A
· PMEG4005EPK, 40V, 0.5A
· PMEG4010EPK, 40V, 1A
· PMEG4015EPK, 40V, 1.5A
link
· SOD1608 package PIP page: http://
· PMEG2005EPK data sheet:
http://
· PMEG2010EPK data sheet:
http://
About NXP Semiconductors
NXP Semiconductors NV (Nasdaq: NXPI) offers high performance mixed signal and standard product solutions with its leading RF, analog, power management, interface, security and digital processing expertise. These innovative products and solutions are used in a wide range of applications in automotive, smart identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing. The company has business executives in more than 25 countries around the world. In 2010, the company's turnover reached $4.4 billion.
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